Optimal Parameter Design for IC Wire Bonding Process by Using Fuzzy Logic and Taguchi Method
نویسندگان
چکیده
منابع مشابه
Optimization of the Cu wire bonding process for IC assembly using Taguchi methods
Article history: Received 11 June 2010 Received in revised form 31 July 2010 Accepted 3 September 2010 0026-2714/$ see front matter 2010 Elsevier Ltd. A doi:10.1016/j.microrel.2010.09.007 ⇑ Corresponding author. Tel.: +886 3 5742936; fax: E-mail address: [email protected] (C.-T. Su). The yield of IC assembly manufacturing is dependent on wire bonding. Recently, the semiconductor industry dema...
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ژورنال
عنوان ژورنال: IEEE Access
سال: 2016
ISSN: 2169-3536
DOI: 10.1109/access.2016.2581258